Northrop Grumman’s Microelectronics Center Magnifies the Microscopic
Manufacturing Microelectronics
In response to today’s dynamic global security threats, Northrop Grumman’s Microelectronics Center is at the forefront of delivering both large-scale and compact solutions. A prime example of this innovation is the evolution of radar systems, which previously relied on as many as eight transmit-receive modules—each roughly the size of a stick of gum. Today, one tiny chip measuring less than a square inch can perform the same functions. This advancement epitomizes the capabilities within Northrop Grumman’s extensive portfolio of systems that utilize cutting-edge microelectronics.
“The Northrop Grumman Microelectronics Center produces the most advanced solutions for multifunction sensing, security, and computing due to the incredible technologies and expansive material sets we have at our disposal,” stated Vern Boyle, vice president of the Microelectronics Center. “We not only provide onshore solutions to protect national interests but can also scale to meet the tailored needs of both the defense industrial base and commercial sectors,” he added.
Northrop Grumman’s secure microelectronics facilities produce millions of microchips annually, tailored specifically to address our nation’s advanced military and commercial challenges. (Photo Credit: Northrop Grumman)
From satellites and telescopes orbiting the Earth to radar systems actively deployed in combat, all these applications rely on the microchips designed and developed by Northrop Grumman’s Microelectronics Center. “We continue to out-invent ourselves,” remarked Matt Hicks, director of foundries, testing, and advanced packaging at the Center. “We’re pushing the boundaries of physics and chemistry in order to enhance our next-generation systems, both for defense and commercial use.”
With access to over 800 materials, Northrop Grumman is well-positioned to create cutting-edge, mission-critical solutions in the microelectronics sector. (Photo Credit: Northrop Grumman)
From Then to Now
The innovative initiatives undertaken in Northrop Grumman’s foundries have played a vital role in establishing the United States’ competitive position in the microelectronics fabrication landscape, utilizing both silicon and compound semiconductor devices. The chips produced have supported historic advancements, including the Lunar Camera that captured humanity’s first steps on the moon, the evolution of mobile technology, and the operational needs of advanced military radars and satellites. This ongoing legacy underscores Northrop Grumman’s commitment to technological advancements.
Currently, the Microelectronics Center is refining transistor technology and collaborating with the defense industrial base to foster groundbreaking innovations. “We are dedicated to developing the best microelectronics solutions for systems and platforms that ensure success for the warfighter repeatedly,” stated Ben Heying, director of microelectronics at Northrop Grumman’s Space Park foundry. “Our solutions not only facilitate battlespace missions but also enhance everyday life through advanced commercial applications.”
The differentiated microelectronics capabilities at Northrop Grumman’s accredited foundries and advanced packaging facility are paving the way for pioneering technological solutions. (Photo Credit: Northrop Grumman)
“For our future missions, expertise in microelectronics will be essential for developing emerging technologies and enhancing the size, weight, and power of upcoming systems,” advised Dave Shahin, manager of the advanced packaging business unit at the Microelectronics Center. “We are strategically positioned to deliver these capabilities and expand them domestically to meet the unique requirements of our customers throughout the industrial base.”
Drive Toward Mission Success
Currently, Northrop Grumman’s secure microelectronics facilities manufacture millions of microchips each year, employing a critical, advanced, and mission-specific manufacturing process from design through to deployment. The company remains committed to enhancing internal fabrication and packaging capabilities, recently announcing a significant capability and capacity expansion at its wafer post-processing facility in Florida, with plans to more than triple production in the coming years. The Microelectronics Center is consistently redefining possibilities, paving the way for what lies ahead to be immeasurable.
Source: Northrop Grumman (2025-07-17T09:30:00Z)
