Northrop Grumman Advances Microchip Tech with Diamond Cooling Innovation
REDONDO BEACH, Calif. – Aug 27, 2026 – Northrop Grumman (NYSE: NOC) is leading a cutting-edge development in microelectronics with a $7 million contract aimed at producing diamond-cooled chips. These advanced chips promise higher power, faster speeds, and significantly improved performance for military radar and communications systems.
The contract represents Phase 2 of DARPA’s Technologies for Heat Removal in Electronics at the Device Scale (THREADS) program. This critical initiative seeks to integrate diamond-based heat-dissipation technology into next-generation semiconductors, marking a significant step forward for defense-grade chips.
Why This Matters:
- Heat threatens modern RF electronics: Today’s RF systems are often operated at reduced levels to avoid overheating, which decreases power efficiency, shortens chip lifespan, and increases circuit failure risks in high-demand situations.
- Diamonds extract heat better than any other material: Diamond conducts heat five times faster than copper and significantly surpasses the performance of silicon carbide and gallium nitride, which are currently used in high-performance applications. Chips cooled with diamond can effectively dissipate heat, allowing for extended operation without overheating.
- Power density could jump tenfold: The ability to pack more power into smaller footprints is crucial for next-generation electronics. Northrop Grumman increased power by 3.3 times during THREADS Phase 1; Phase 2 aims to achieve even greater improvements, enhancing RF transmitters for military communications and satellite links.
Ben Heying, director of microelectronics at Northrop Grumman’s Space Park Foundry, remarked, “Temperature has long capped what microelectronics can do, even Gallium Nitride (GaN), which is a standard today. Embedding diamond directly into chips acts like a turbocharged cooling system. It keeps the chips cool, allowing us to crank up the power without the risk of burnout. This breakthrough enables Northrop Grumman’s diamond-cooled chips to surpass traditional heat limits, unlocking a new generation of fast, reliable RF electronics.”
Phase 2 of the THREADS program targets an ambitious goal of tripling the power density, which is a direct result of Northrop Grumman’s investment in diamond technology that began in 2019. By leveraging diamond’s exceptional heat conductivity and its capacity to withstand extreme temperatures, the company is set to turn a significant research breakthrough into a strategic advantage for developing high-power, mission-critical semiconductors.
Northrop Grumman designs, manufactures, assembles, tests, and packages millions of microelectronics each year, serving the next generation of defense and commercial systems in the United States. This robust manufacturing infrastructure contributes to a secure and sustainable American supply chain, playing a vital role in powering mission success.
As a leading global aerospace and defense technology company, Northrop Grumman’s innovative solutions equip customers with the necessary capabilities to connect and protect the world while advancing human exploration across the universe.
Source: Northrop Grumman (2026-08-27T13:59:00Z)
